ISAAT 2004
The Seventh International Symposium on Advances in Abrasive Technology
17-19 June 2004, Bursa, Turkey
http://www.diemold-isaat.org/
List of Accepted Papers for Publication
Grinding Wheel and Performance Assessment (10) | |
Theoretical Study on the Wheel-Wear Removal using the New Round-off-Truing Method | S. Okuyama, T. Kitajima and A. Yui |
Study on Effect of Cutting Edge Truncation on Grinding Mechanism by Computer Simulation | J. Tamaki, A. Kubo, J. Yan and T. Iyama |
FEM-Simulation of CNC Crushing for Vitreous Bonded Diamond Grinding Wheels | B. Denkena, J. C. Becker and F. Catoni |
The Effect of Wheel Run-out and Waveshift on Regenerative Chatter | T. R. A. Pearce and D. C. Fricker |
Effect of Incident Angle and Critical Angle on Laser Processing of a Small Vitrified CBN Grinding Wheel | X. Wang, Y. Wu and J. Wang |
Geometrical Arrangement of ID Grinding Wheel in Simultaneous-ID/OD Combination Centerless Grinding | Y. Wu and M. Kato |
New Diamond Grinding Wheel with Electrically Conductive Cutting Edges | K. Suzuki, M. Iwai, A. Sharma, K. Kawanaka, T. Uematsu and K. Tanaka |
Grinding of Granite with Brazed Diamond Tools | Y. Li, H. Huang and X. P. Xu |
Grinding Performance under Laser Cleaning | X. Chen and Z. Feng |
A Study of the Grinding Characteristic of Ferrule | H. Z. Choi, S. W. Lee, E. G. Kang and N. K. Kim |
Cooling and Coolant (5) | |
Cool-air Grinding Characteristics of Ductile Materials by CBN Wheel | T. Tanaka and Y. Morisada |
Optimization of the Cooling Conditions in Continuous Generating Grinding of Gears | B. Denkena, J. C. Becker, M. Jung and F. Catoni |
Performance of a Floating Nozzle in Various Grinding Operations | K. Suzuki, S. Ninomiya, M. Iwai, T. Uematsu and R. Mukai |
Improvement of Grinding Performance in Ultra Precision Grinding of Lens Mold by the Help of Megasonic Coolant | K. Suzuki, T. Tanaka, M. Fukuda, M. Iwai, T. Uemastu and S. Mishiro |
Application of Megasonic Coolant to Drilling Process | M. Iwai, T. Goutani, T. Uematsu, K. Suzuki and K. Tanaka |
Machine Tools and Components (5) | |
Reduction of Rocking of Surface Grinding Machines by using M2052 Mounts of Twin Type High Damping Alloy | K. Yoshida, Y. Noda, M. Maejima, K. Yanagida and H. Inuzuka |
Modeling of Sinusoidal Excitation Based on Polynomial Regression for Micro-Positioning for Grinding Process Control | Y. Gao, S. Tse and K. Chan |
Development of Shrinking Tool Holder by utilizing Shape Memory Alloy Material | K. Kitajima, H. Sogabe and M. Hiromi |
Development of Lapping Tape with Uneven Pattern Surface by using Backing Material of Polyester Film of Difficult-Crystallization | K. Kitajima, N. Hazama, Tottori and T. Yasuda |
Functional Prototype Development of Mobile IT Parts | Y. Im, S. Chung, B. Cho and H. Jeong |
CMP and Planalization (6) | |
High Temperature MCP Process Suitable for Extremely Hard High Functional Sic Wafers | N. Yasunaga, Y. Yamamoto, C. Takauo and N. Ikenaka |
A Basic Study on CMP Mechanism and a Trial to Produce CMP Slurry by Sol-Gel Method | J. Shibata, M. Ota and A. Oda |
Simulation on Planarization Process of Device Wafer | L. Zhou, H. Ohkubo, J. Shimizu and H. Eda |
Wear Rate Estimation for Pad Dressing in Planarization Process | T. L. Horng |
Average Flow Model with Elastic Deformation for CMP | T.W. Kim, Y.J. Cho and Y.P. Koo |
A Study on Manufacture and Evaluation of CMP Pad with Micro-Structure | J. Y. Choi, H. j. Kim, J.H.Park, S. Chung, H. Jeong and M. Kinoshita |
Polishing (3) | |
Electrorheological Fluid-Assisted Polishing of WC Micro Aspherical Glass Molding Dies | T. Kaku, T. Kuriyagawa and N. Yoshihara |
The Potential of Precessions Loose-Abrasive Polishing of Complex Free-form Surfaces | D. D. Walker, A. Beaucamp, L. Blunt, R. Freeman, A. Marek, R. Morton and G. McCavana |
Investigation of Polishing Conditions in the Dynamic Friction Polishing Method for Diamond | M.Iwai, Y.Takashima, K.Suzuki and T.Uematsu |
Dicing and Cut Off (4) | |
A Study on Dicing Process of Silicon Wafer for Fabricating PDP Barrier Ribs | S. Chung, Y. Im, J. Choi and H. Jeong |
Dicing of Thin Stacked Wafer Packages | H.H. Gatzen and G. Günzel |
Development of a Crack Cutting Method for Glass Plates used for Flat Panel Displays | K.Suzuki, Y.Shishido, T.Shirai, M.Iwai and T.Uematsu |
Study on Hi-speed Dicing using Ultrasonic Vibration | K. Ishikawa, H. Suwabe, Y. Tanno and Y. Take |
Measurement and Instrumentation (3) | |
Control of a Machine-Table Reciprocation using a Hydrophone | A. Yui, S. Okuyama and T. Kitajima |
Grinding Burn Identification through the AE Monitoring | X. Chen and Q. Liu |
Measurement of Diamond Abrasive Grain Temperature in Grinding using Infrared Radiation Pyrometer | M. Sato and H. Tanaka |
Micro/Nano Processes (5) | |
Micro Deburring Technology Using Ultrasonic Vibration with Abrasive | S. W. Lee, H. Z. Choi, Y. J. Choi, G.H. Kim and S.L. Ko |
Machining Characteristics of Micro Grooving for the Mold of PDP Barrier Rib | E.S. Lee and N.H. Kim |
Vibration Micromachining of Low-Melting-Temperature Glass | N. Moronuki, Y. Saito, A. Kaneko, A. Miura and C. Aikawa |
Fundamental Research for Micro Machining of Fluorocarbon Resins for Application to Micro-TAS | S. Hira, M. Yoshioka, N. Terada, H. Yamada, T. Kojima, H. Ueno, Y. Sakamoto and H. Motegi |
Nanoscale Fabrication in Aqueous KOH Solution by Tribo Nanolithography | N. Kawasegi, J. W. Park, N. Morita, S. Yamada, N. Takano, T. Oyama and K. Ashida |
Surface Quality (4) | |
Characterization of White Layers Inflicted by Mechanical and Thermal Loads within Manufacturing Processes | B. Denkena, M. Jung, C. Muller and N. Kramer |
Effect of Laser Irradiation on Bending Direction in CO2 Laser Forming of Magnesium Alloy Plate | K. Okuda, Y. Toda and M. Nunobiki |
Improvement of Surface Texture of Stainless Steel by Utilizing Dry Blasting | K. Minaki, K. Kitajima, K. Minaki and M. Izawa |
Nano-Topography on Axis Symmetric Aspherical Ground Surfaces | N. Yoshihara, T. Kuriyagawa, H. Ono and K. Syoji |
Cutting and Novel Machining Techniques (7) | |
Influence of Material of Small Radius Ball End Mill on Cutting Accuracy in Deep Precision Machining | K. Kitajima, A. Ueda, T. Fuji, S. Minamino and T. Akamatsu |
Cutting Characteristics of Aluminum Alloy by Using DLC Coated Tool ~Effect of Coating Condition ~ | K. Kitajima, T. Fuji, T. Hasegawa, N. Sima and S. Kaminomura |
High Efficient Milling of EDM Electrodes | Y. Murakami and Y. Hamatake |
Ultrasonic Vibration Assisted Drilling of Fine Ceramics | S. Koshimizu |
Modeling the Cutting Performance of AWJ Machining with Nozzle Oscillation | S. Xu and J. Wang |
Low-Wear Diamond Electrode for Micro-EDM of Die-Steel | A.Sharma, M.Iwai, K.Suzuki and T.Uematsu |
Attempt at EDM of Electrically Conductive Diamond and its Application to Miniature Mold Processing | A. Sharma, M. Iwai, K. Kawanaka, K. Suzuki and T. Uematsu |
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05 July 2004