ISAAT 2004

The Seventh International Symposium on Advances in Abrasive Technology

17-19 June 2004, Bursa, Turkey

http://www.diemold-isaat.org/
 

List of Accepted Papers for Publication

 

Grinding Wheel and Performance Assessment (10)  
Theoretical  Study on the Wheel-Wear  Removal using the New  Round-off-Truing Method S. Okuyama, T. Kitajima and A. Yui
Study on Effect of Cutting Edge Truncation on Grinding Mechanism by Computer Simulation J. Tamaki, A. Kubo, J. Yan and T. Iyama
FEM-Simulation of CNC Crushing for Vitreous Bonded Diamond Grinding Wheels B. Denkena, J. C. Becker and F. Catoni
The Effect of Wheel Run-out and Waveshift on Regenerative Chatter T. R. A. Pearce and D. C. Fricker
Effect of Incident Angle and Critical Angle on Laser Processing of a Small Vitrified CBN Grinding Wheel  X. Wang, Y. Wu and J. Wang
Geometrical Arrangement of ID Grinding Wheel in Simultaneous-ID/OD Combination Centerless Grinding Y. Wu and M. Kato
New Diamond Grinding Wheel with Electrically Conductive Cutting Edges K. Suzuki, M. Iwai, A. Sharma, K. Kawanaka, T. Uematsu and K. Tanaka
Grinding of Granite with Brazed Diamond Tools Y. Li, H. Huang and X. P. Xu
Grinding Performance under Laser Cleaning X. Chen and Z. Feng
A Study of the Grinding Characteristic of Ferrule H. Z. Choi, S. W. Lee, E. G. Kang and N. K. Kim
Cooling and Coolant (5)  
Cool-air Grinding Characteristics of Ductile Materials by CBN Wheel T. Tanaka and Y. Morisada
Optimization of the Cooling Conditions in Continuous Generating Grinding of Gears B. Denkena, J. C. Becker, M. Jung and F. Catoni
Performance of a Floating Nozzle in Various Grinding Operations K. Suzuki, S. Ninomiya, M. Iwai, T. Uematsu and R. Mukai
Improvement of Grinding Performance in Ultra Precision Grinding of Lens Mold by the Help of Megasonic Coolant K. Suzuki, T. Tanaka, M. Fukuda, M. Iwai, T. Uemastu and S. Mishiro
Application of Megasonic Coolant to Drilling Process M. Iwai, T. Goutani, T. Uematsu, K. Suzuki and K. Tanaka
Machine Tools and Components (5)  
Reduction of Rocking of Surface Grinding Machines by using M2052 Mounts of Twin Type High Damping Alloy K. Yoshida, Y. Noda, M. Maejima, K. Yanagida and H. Inuzuka
Modeling of Sinusoidal Excitation Based on Polynomial Regression for Micro-Positioning for Grinding Process Control Y. Gao, S. Tse and K. Chan
Development of Shrinking Tool Holder by utilizing Shape Memory Alloy Material K. Kitajima, H. Sogabe and M. Hiromi
Development of Lapping Tape with Uneven Pattern Surface by using Backing Material of Polyester Film of Difficult-Crystallization K. Kitajima, N. Hazama, Tottori and T. Yasuda
Functional Prototype Development of Mobile IT Parts Y. Im, S. Chung, B. Cho and H. Jeong
CMP and Planalization (6)  
High Temperature MCP Process Suitable for Extremely Hard High Functional Sic Wafers N. Yasunaga, Y. Yamamoto, C. Takauo and N. Ikenaka 
A Basic Study on CMP Mechanism and a Trial to Produce CMP Slurry by Sol-Gel Method J. Shibata, M. Ota and A. Oda
Simulation on Planarization Process of Device Wafer L. Zhou, H. Ohkubo, J. Shimizu and H. Eda
Wear Rate Estimation for Pad Dressing in Planarization Process T. L. Horng
Average Flow Model with Elastic Deformation for CMP T.W. Kim, Y.J. Cho and Y.P. Koo
A Study on Manufacture and Evaluation of CMP Pad with Micro-Structure  J. Y. Choi, H. j. Kim, J.H.Park, S. Chung, H. Jeong and M. Kinoshita 
Polishing (3)  
Electrorheological Fluid-Assisted Polishing of WC Micro Aspherical Glass Molding Dies T. Kaku, T. Kuriyagawa and N. Yoshihara
The Potential of Precessions Loose-Abrasive Polishing of Complex Free-form Surfaces D. D. Walker, A. Beaucamp, L. Blunt, R. Freeman, A. Marek, R. Morton and G. McCavana
 Investigation of Polishing Conditions in the Dynamic Friction Polishing Method for Diamond M.Iwai, Y.Takashima, K.Suzuki and T.Uematsu 
Dicing and Cut Off (4)  
A Study on Dicing Process of Silicon Wafer for Fabricating PDP Barrier Ribs S. Chung, Y. Im, J. Choi and H. Jeong
Dicing of Thin Stacked Wafer Packages H.H. Gatzen and G. Günzel
Development of a Crack Cutting Method for Glass Plates used for Flat Panel Displays K.Suzuki, Y.Shishido, T.Shirai, M.Iwai and T.Uematsu
Study on Hi-speed Dicing using Ultrasonic Vibration K. Ishikawa, H. Suwabe, Y. Tanno and Y. Take
Measurement and Instrumentation (3)  
Control of a Machine-Table Reciprocation using a Hydrophone A. Yui, S. Okuyama and T. Kitajima
Grinding Burn Identification through the AE Monitoring X. Chen and Q. Liu
Measurement of Diamond Abrasive Grain Temperature in Grinding using Infrared Radiation Pyrometer M. Sato and H. Tanaka
Micro/Nano Processes (5)  
Micro Deburring Technology Using Ultrasonic Vibration with Abrasive S. W. Lee, H. Z. Choi, Y. J. Choi, G.H. Kim and S.L. Ko
Machining Characteristics of Micro Grooving for the Mold of PDP Barrier Rib E.S. Lee and N.H. Kim
Vibration Micromachining of Low-Melting-Temperature Glass N. Moronuki, Y. Saito, A. Kaneko, A. Miura and C. Aikawa
Fundamental Research for Micro Machining of Fluorocarbon Resins for Application to Micro-TAS S. Hira, M. Yoshioka, N. Terada, H. Yamada, T. Kojima, H. Ueno, Y. Sakamoto and H. Motegi
Nanoscale Fabrication in Aqueous KOH Solution by Tribo Nanolithography N. Kawasegi, J. W. Park, N. Morita, S. Yamada, N. Takano, T. Oyama and K. Ashida 
Surface Quality (4)  
Characterization of White Layers Inflicted by Mechanical and Thermal Loads within Manufacturing Processes B. Denkena, M. Jung, C. Muller and N. Kramer 
Effect of Laser Irradiation on Bending Direction in CO2 Laser Forming of Magnesium Alloy Plate K. Okuda, Y. Toda and M. Nunobiki
Improvement of Surface Texture of Stainless Steel by Utilizing Dry Blasting K. Minaki, K. Kitajima, K. Minaki and M. Izawa
Nano-Topography on Axis Symmetric Aspherical Ground Surfaces N. Yoshihara, T. Kuriyagawa, H. Ono and K. Syoji
Cutting and Novel Machining Techniques (7)  
Influence of Material of Small Radius Ball End Mill on Cutting Accuracy in Deep Precision Machining K. Kitajima, A. Ueda, T. Fuji, S. Minamino and T. Akamatsu 
Cutting Characteristics of Aluminum Alloy by Using DLC Coated Tool ~Effect of Coating Condition ~ K. Kitajima, T. Fuji, T. Hasegawa, N. Sima and S. Kaminomura
High Efficient Milling of EDM Electrodes  Y. Murakami and Y. Hamatake
Ultrasonic Vibration Assisted Drilling of Fine Ceramics S. Koshimizu
Modeling the Cutting Performance of AWJ Machining with Nozzle Oscillation S. Xu and J. Wang
Low-Wear Diamond Electrode for Micro-EDM of Die-Steel A.Sharma, M.Iwai, K.Suzuki and T.Uematsu
Attempt at EDM of Electrically Conductive Diamond and its Application to Miniature Mold Processing A. Sharma, M. Iwai, K. Kawanaka, K. Suzuki and T. Uematsu

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05 July 2004